The Mesh argues that photonic interconnects are essential for overcoming the physical and economic limits of electrical interconnects in AI data centers. With advancements like Lightmatter’s Passage L...
Samsung and AMD have partnered to deliver next-gen HBM4 and DDR5 memory for GPUs and CPUs, while NVIDIA launched its Vera Rubin platform with seven new chips for agentic AI workloads. These moves high...
monday.com launched its agentic AI infrastructure on March 20, 2026, to advance autonomous workflow automation for enterprises. The platform supports dynamic task execution and decision-making, aiming...
Elon Musk announced the Terafab project on March 22, 2026, aiming to increase global AI chip production capacity by 50 times through new semiconductor fabrication plants. The initiative seeks to addre...
Elon Musk announced the Terafab project on March 22, 2026, to design and manufacture proprietary AI chips with in-house fabrication capabilities. This vertical integration aims to reduce supply chain ...
In 2026, enterprise AI agent platforms are undergoing significant transformation driven by Model-Chain-Plugin (MCP) strategies, agent-native tooling, and spec-first AI coding environments. These devel...
OpenClaw’s Venice platform challenges the AI industry to prioritize privacy as a foundational principle rather than an afterthought. This opinion piece argues that Venice’s integration of privacy-enha...
Tesla and SpaceX have jointly launched Terafab, an automated manufacturing facility designed to mass-produce AI infrastructure for both terrestrial and space applications. The facility aims to address...
AMD has partnered with South Korean startup Upstage to deploy 10,000 MI300 GPUs throughout 2026, expanding AI computing capacity in the region. This deployment supports South Korea’s national strategy...
Officials broke ground on March 20, 2026, for a new data center in Pike County projected to be the largest in the U.S. The project aims to expand AI computing capacity, create jobs, and support both p...